Electronics / PCB Quality Control
Inspection of solder joints, components, and defects on printed circuit boards.
Component miniaturization demands high-precision visual inspection. Smart G-Scope enables engineers and quality technicians to inspect solder joints, traces, vias, and SMD components at magnification levels suitable for detecting microscopic defects.
It can help identify solder bridges, cracks, contamination, component misalignment, and wetting issues that may cause failures in production or in the field. Documenting defects supports traceability and continuous process improvement.
The device’s portability allows use both on production lines and in failure analysis labs, adapting to different industrial environments.
Key benefits
- Detection of microcracks, solder bridges, and solder balls
- Inspection of BGA, QFN, and micro-components
- Defect documentation for quality reports
- Failure analysis and lot traceability
- Usable in production and R&D labs
Image gallery
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Practical examples
SMD soldering inspection
On an LED board production line, a quality technician uses Smart G-Scope to inspect samples from each lot, detecting solder bridges before boards move to the next process step.
Field-failure analysis
An engineer examines a returned board with intermittent failure. The microscope reveals a microcrack in a BGA joint caused by thermal stress, enabling a heatsink design correction.
Limitations & best practices
- Internal layer inspection requires X-ray or cross-section microscopy.
- Keep the work area clean to prevent cross-contamination.
- Calibrate magnification scaling for accurate measurements.
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